Network Processing Devices White Papers

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ACP- The Truth About Power Consumption Starts Here
sponsored by Dell, Inc. and AMD
WHITE PAPER: Based on customer demands, one company as developed a new metric designed to give customers a more accurate idea of the power consumed by the processor, thus enabling the customer to more accurately plan for future power budgets.
Posted: 24 Aug 2011 | Published: 24 Aug 2011

Dell, Inc. and AMD

Unified Visibility Fabric Architecture – A New Approach to Visibility
sponsored by Gigamon
WHITE PAPER: In this informative white paper, uncover a unified visibility fabric architecture that centralizes network monitoring and management tools for improved and simplified performance and security analysis.
Posted: 24 Sep 2013 | Published: 30 Aug 2013

Gigamon

Real-time Compression Results In Storage Efficiency
sponsored by IBM
WHITE PAPER: Access this white paper to learn about a storage system that uses real-time compression and SSD technology to boost storage performance. Read on to learn more about how the benefits of this storage system provide a strong ROI, and how your organization could cut costs.
Posted: 01 Apr 2015 | Published: 30 Apr 2014

IBM

Indonesia Stock Exchange halves its hardware investment cost with a Red Hat Solution
sponsored by Red Hat and Intel
WHITE PAPER: This brief whitepaper explains how the Indonesian Stock Exchange (IDX) was able to half its hardware costs by leveraging a Linux system to support trading machines, surveillance machines, database engines, and more.
Posted: 16 Dec 2013 | Published: 16 Dec 2013

Red Hat and Intel

Top 3 Reasons for IT to Adopt Desktop Virtualization
sponsored by VMware
WHITE PAPER: This whitepaper explains the three major reasons organizations should absolutely consider VDI for the business.
Posted: 07 Oct 2013 | Published: 07 Oct 2013

VMware

WebSphere DataPower Integration Blade XI50B
sponsored by IBM
WHITE PAPER: Read this paper to learn about WebSphere DataPower Integration Blade XI50B, a specialized, high-performance hardware appliance that can empower you t improve competitiveness by helping to strengthen business connectivity with partners and customers, and between internal organizations, add specialized connectivity, integration and more.
Posted: 12 Apr 2012 | Published: 12 Apr 2012

IBM

Intel® Xeon® Processor 5500 Series: An Intelligent Approach to IT Challenges
sponsored by Hewlett Packard Company and Intel
WHITE PAPER: As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with servers that deliver more performance and scalability, more efficiently. Read on to learn more.
Posted: 08 Jul 2009 | Published: 08 Jul 2009

Hewlett Packard Company and Intel

PACs for Industrial Control, the Future of Control
sponsored by National Instruments
WHITE PAPER: This white paper explores the origins of the Programmable Automation Controllers (PAC), how PACs differ from Programmable Logic Controllers (PLC) and PCs, and the future direction of industrial control with PACs.
Posted: 16 Sep 2008 | Published: 16 Sep 2008

National Instruments

A reference architecture for a leading solution
sponsored by DellEMC and Intel®
WHITE PAPER: This white paper explores the reference architecture for a leading server solution. Learn how this architecture is designed to influence the benefits of virtualizing the underlying infrastructure and address the common problems associated with hardware sprawl.
Posted: 21 Oct 2014 | Published: 30 Sep 2014

DellEMC and Intel®

Enterprise Solution Design for SAP HANA
sponsored by HP & Intel®
WHITE PAPER: In this resource, explore the three principles of great enterprise design—stability, scalability, and agility—and learn how to apply them to your SAP landscape with a focus on SAP HANA. Read on for best practices and key design considerations for implementing your SAP HANA enterprise-level solution.
Posted: 25 Sep 2013 | Published: 28 Feb 2013

HP & Intel®